Annual Scholarship Increased to $5,000 in 2010
Bonnie Lewis-Doggett
and family established the Terrence Eagan Lewis Scholarship in 2003, after accumulating $12,000 from memorial donations and
gifts received on Terry’s behalf.
Terrence Eagan Lewis was Co-Founder of BonTEL
Fastener Corporation, located in Pinellas Park, Florida.
The scholarship is intended to encourage and support capable students who have graduated from high school or have
obtained a GED; are an employee or immediate family member (mother, father, daughter, son or individual living in the same
household) of an employer who is currently a member of FBMA; and enrolled in a 2 or
4 year accredited college, studying architecture, engineering, business management or another applicable program relevant
to the building materials industry.
In order to be considered, you must follow these four steps and mail your application by July
16, 2010. Applications will not be accepted by fax or e-mail. All applications must be postmarked
by July 16, 2010 or they will not be considered.
Step 1:
Complete and sign Part A of the Application Form.
Step 2: Write a personal statement (a maximum of two type written pages). A resume may be included,
but is not required.
Step 3: Submit your most recent academic transcript(s).
If this will be your first semester enrolled in college, a copy of your high school diploma (or GED equivalency) must be submitted
as well.
Step 4: Include a photograph for publication (this will not
be seen by the selection committee, but rather FBMA staff).
The Scholarship Selection Committee, who is composed of no less than five FBMA Education Committee members, has the
authority to select recipients based on the qualifications and merits of the applicants and will be the governing body in
determining the award.
